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Obvod: MT29F2G08ABAEAH4 [VFBGA63] (SAG-01)

Výrobca: Micron

Popis čísla dielu pre toto zariadenie:

Nabehnutím kurzora zvýraznite konkrétnu sekciu
MT Micron Technology  
XXX Product Family 29F = Single-supply NAND flash
29E = Enterprise NAND flash
29H = High-speed NAND flash
XX Density 1G = 1Gbit
2G = 2Gbit
4G = 4Gbit
8G = 8Gbit
16G = 16Gbit
32G = 32Gbit
64G = 64Gbit
128G = 128Gbit
256G = 256Gbit
512G = 512Gbit
1T = 1Tbit
2T = 2Tbit
4T = 4Tbit
XX Device Width 01 = 1bit
08 = 8 bits
16 = 16bits
X Level A = SLC
B = Reserved
C = MLC-2
E = TLC
X Classification A = 1 die, 0 nCE, 0 RnB, 1 I/O channel
B = 1 die, 1 nCE, 0 RnB, 1 I/O channel
D = 2 dies, 1 nCE, 1RnB, 1 I/O channel
E = 2 dies, 2 nCE, 2 RnB, 2 I/O channels
F = 2 dies, 2 nCE, 2 RnB, 1 I/O channel
G = 3 dies, 3 nCE, 3 RnB, 3 I/O channels
J = 4 dies, 2 nCE, 2 RnB, 1 I/O channel
K = 4 dies, 2 nCE, 2 RnB, 2 I/O channels
L = 4 dies, 4 nCE, 4 RnB, 4 I/O channel
M = 4 dies, 4 nCE, 4 RnB, 2 I/O channels
Q = 8 dies, 4 nCE, 4 RnB, 4 I/O channel
R = 8 dies, 2 nCE, 2 RnB, 2 I/O channels
T = 16 dies, 8 nCE, 4 RnB, 2 I/O channel
U = 8 dies, 4 nCE, 4 RnB, 2 I/O channels
V = 16 dies, 8 nCE, 4RnB, 4 I/O channels
X Operating Voltage Range A = Vcc: 3.3V (2.70V to 3.60V), Vccq: 3.3V (2.70V to 3.60V)
B = Vcc: 1.8V (1.70V to 1.95V), Vccq: 1.8V (1.70V to 1.95V)
C = Vcc: 3.3V (2.70V to 3.60V), Vccq: 1.8V (1.70V to 1.95V)
E = Vcc: 3.3V (2.70V to 3.60V), Vccq: 3.3V (2.70V to 3.60V) or
1.8V (1.70V to 1.95V)
F = Vcc: 3.3V (2.50V to 3.60V), Vccq: 1.2V (1.14V to 1.26V)
G = Vcc: 3.3V (2.60V to 3.60V), Vccq: 1.8V (1.70V to 1.95V)
H = Vcc: 3.3V (2.50V to 3.60V), Vccq: 1.2V (1.14V to 1.26V) or
1.8V (1.70V to 1.95V)
J = Vcc: 3.3V (2.50V to 3.60V), Vccq: 1.8V (1.70V to 1.95V)
K = Vcc: 3.3V (2.60V to 3.60V), Vccq: 3.3V (2.60V to 3.60V)
L = Vcc: 3.3V (2.60V to 3.60V), Vccq: 3.3V (2.60V to 3.60V) or
1.8V (1.70V to 1.95V)
X Generation Feature Set A = 1-st set of device features
B = 2-nd set of device features (only if different than 1-st set)
C = 3-rd set of device features (only if different)
D = 4-th set of device features (only if different)
etc.
X Interface A = Asynchronous only
B = Synchronous/Asynchronous
C = Synchronous only
D = SPI
XX Package Code SF = 16-pin SOP, 300mils
WP = 48-pin TSOP I (CPL version, Pb-free)
WC = 48-pin TSOP I (OCPL version, Pb-free)
WB = 8-pin U-PDFN, 6x8x0.65
C3 = 52-pad ULGA, 12x17x0.65
C4 = 52-pad VLGA, 12x17x1.0(SDP/DDP/QDP)
C5 = 52-pad VLGA, 14x18x1.0(SDP/DDP/QDP)
C6 = 52-pad LLGA, 14x18x1.47(DDP/QDP/8DP)
C7 = 48-pad LLGA, 12x20x1.47(8DP)
C8 = 52-pad WLGA, 14x18x0.75(DDP/QDP)
G1 = 272-ball VBGA, 14x18x1.0 (SDP, DDP, 3DP, QDP)
G2 = 272-ball VBGA, 14x18x1.3 (QDP, 8DP)
G6 = 272-ball VBGA, 14x18x1.5 (16DP)
H1 = 100-ball VBGA (Pb-free), 12x18x1.0
H2 = 100-ball TBGA (Pb-free), 12x18x1.2
H3 = 100-ball LBGA (Pb-free), 12x18x1.4 (DDP/QDP/8DP)
H4 = 63-ball VFBGA, 9x11x1
HC = 63-ball VFBGA, 10.5x13x1.0
H6 = 152-ball VBGA, 14x18x1.0 (SDP, DDP)
H7 = 152-ball TBGA, 14x18x1.2 (QDP)
H8 = 152-ball LBGA, 14x18x1.4 (8DP)
H9 = 100-ball LBGA, 12x18x1.6 (16DP)
J1 = 132-ball VBGA, 12x18x1.0 (SDP, DDP)
J2 = 132-ball TBGA, 12x18x1.2 (QDP)
J3 = 132-ball LBGA, 12x18x1.4 (8DP)
J4 = 132-ball VBGA, 12x18x1.0 (SDP, DDP)
J5 = 132-ball TBGA, 12x18x1.2 (QDP)
J6 = 132-ball LBGA, 12x18x1.4 (8DP)
J7 = 152-ball LBGA, 14x18x1.5 (16DP)
J9 = 132-ball LBGA, 12x18x1.5 (16DP)
12 = 24-ball T-PBGA, 6x8x1.5
XX Speed Grade (Synchronous) Blank = Asynchronous only
20 = 100MT/s
15 = 133MT/s
12 = 166MT/s
10 = 200MT/s
6 = 333MT/s
5 = 400MT/s
4 = 533MT/s
3 = 667MT/s
XX Temperature Range Blank = Commercial (0°C to 70°C)
AAT = Automotive Industrial (-40°C to 105°C)
AIT = Automotive Industrial (-40°C to 85°C)
IT = Extended (-40°C to 85°C)
WT = Wirelles (-25°C to 85°C)
X Special Options E = Error correction with internal ECC enabled
M = Media
R = MLC+Features
X = Premium lifecycle product (PLP)
S = Security features
Z = Polyimide (if applicable)
XX Production Status Blank = Production
ES = Engineering samples
QS = Qualification samples
MS = Mechanical samples
:    
X Design Revision (Shrink) A = 1-st design revision
B = 2-nd design revision
etc.

Poznámka: Tabuľka popisu čísla dielu popisuje bežný systém číslovania dielov pre viac čipov, preto môže táto tabuľka obsahovať informácie, ktoré nemusia byť platné pre aktuálne vybraný čip. Tu uvedené informácie sú poskytované na základe maximálneho úsilia a môžu byť nepresné alebo neúplné. Preto vždy skontrolujte najnovší technický list čipu, kde nájdete detailný popis čísla dielu. Ak nájdete nejakú nepresnosť, dajte nám vedieť.

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Podporovaný programátormi a programovacími adaptérmi/modulmi:

BeeHive204 adaptér/modul: DIL48/BGA63-1 ZIF NAND-1 (70-3105) Support of this chip is restricted to some programmer[s] only. Contact manufacturer of programmer for details.
BeeHive204AP adaptér/modul: AP1 BGA63-1 ZIF NAND-1 (71-3669) Support of this chip is restricted to some programmer[s] only. Contact manufacturer of programmer for details.
BeeHive208S adaptér/modul: DIL48/BGA63-1 ZIF NAND-1 (70-3105) Support of this chip is restricted to some programmer[s] only. Contact manufacturer of programmer for details.
BeeProg2 adaptér/modul: DIL48/BGA63-1 ZIF NAND-1 (70-3105) Support of this chip is restricted to some programmer[s] only. Contact manufacturer of programmer for details.
BeeProg2AP adaptér/modul: AP1 BGA63-1 ZIF NAND-1 (71-3669) Support of this chip is restricted to some programmer[s] only. Contact manufacturer of programmer for details.
BeeProg2C adaptér/modul: DIL48/BGA63-1 ZIF NAND-1 (70-3105) Support of this chip is restricted to some programmer[s] only. Contact manufacturer of programmer for details.
BeeHive204AP-AU (prestala byť podporovaná) adaptér/modul: AP1 BGA63-1 ZIF NAND-1 (71-3669) Support of this chip is restricted to some programmer[s] only. Contact manufacturer of programmer for details.
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